Submission Date
08 OCT 2026Opening Date
Refer DocumentTender Estimated Cost
Refer DocumentEMD
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Indian Army has invited bids for the supply of - self inking rubber stamp (v2) (q4) , visiting cards (v3) (q4) , correspondence envelopes (v3) (q4) , dongle with esign activation by emudra , acrylic board for pull push no mobile phone allowed , small letter pad and big letter pad , pull push board large , brass name plate 8 inch x 18 inch , do pads , cards , brass name plate 24 inch x 12 inch , flex - rubber stamp | quantity - 863.. Please refer to the tender document for project value and EMD details. Interested bidders can submit applications until 8 October 2026. Please refer to the tender document for the bid opening date.
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Please refer to the tender document for EMD details.
Bids close on 8 October 2026.
Indian Army, West Bengal.